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USP-10B packaging information reference pattern layout dimension note : reference metal mask design unit: mm packaging information / reference pattern layout dimensions 12345 9 876 2.90.05 10 2.50.05 0.125 0.15 0.20.05 0.20.05 0.20.05 0.450.05 0.450.05 0.10.03 (0.65) (0.65) (0.5) (0.5) 0.10.03 1pin indent (0.45) (0.2) 1.45 1.45 0.35 1.10 1.10 0.35 0.70 0.70 1.50 1.50 1.05 1.05 0.8 0.8 0.4
USP-10B reel taping specifications taping specifications unit: mm 3,000pcs/reel r type :[device orientation : right] standard feed direction of feed
USP-10B power dissipation power dissipation data for the USP-10B is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition : mount on a board ambient : natural convection soldering : lead (pb) free board : dimensions 40mm40mm 1600mm 2 in one side 1st inner metal layer about 50% 2nd inner metal layer does not exist 3rd inner metal layer does not exist 4th inner metal layer about 50% each heat sink back metal is connected to the inner layers respectively. material : glass epoxy fr-4 thickness : 1.6mm through-hole : 4 x 0.8 diameter evaluation board (unit: mm) 2. power dissipation vs. ambient temperature board mount ( tjmax=125) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 1000 85 400 100.00
USP-10B USP-10B perspective rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??? ?? lead pad nickel ?I au ? ?? outer pad plating gold plating except the side of the terminals. ? ? die attach epoxy ???? au bonding wire ?? silicon chip ?? `` marking laser marking si ver.11

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